Ultrasonic Wire Bonder 4526 from Kuliche & Soffa
Ultrasonic Wire Bonder 4526 from Kuliche & Soffa
The 4526 Series Manual Ball Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications. Semi-automatic and manual operation modes, individual bond parameter control, and capacity for a wide range of wire diameters enable ease of use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.
FEATURES:
Independent Manual Z-Axis control, separate from X- and Y-Axis control.
Independently adjustable wire parameters:
- Separate Force Control for each bond, adjustable and independent per channel.
- Separate Bond Time Control for each bond.
- Separate Bond Power Control for each bond.
No springs are used to apply bond force; digitally controlled components are utilized.
Standard bonding, deep access and ribbon bonding with same bond head “tool assembly”. No need to change “tool assembly".
Motorized wire clamp motion with linear stepper motor.
Auto-stepback mode is included, with a motorized Y-stage.
Stitch mode is included.
Standard reset height is .260” with full range fine Z-motion control.
High reset height is .500” for tall package clearance.
Wire sizes are from .0007” dia., to .003” dia. (18 – 75 micron diameter) aluminum (Al) and gold (Au).
Ribbon sizes are up to .001” x .010” (Au).
CONTACT US
Phone: (+34) 935 801 853
Email:
Tlf.: (+34) 935 801 853; ext. 363/335 |
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Tlf.: (+34) 935 801 853; ext. 364/335 |
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Tlf.: (+34) 935 801 853; ext. 365/335 |
EQUIPMENTS
- Atomic Layer Deposition System - Savannah from Cambridge NanoTech
- Basic II-Acids & Corrosives
- Basic I-Solvents
- Centrifuge - Allegra 64R from Beckman Coulter
- Dip Coater - DM 201 Automatic from Chemat Technology Inc.
- Drop Shape Analyzer - DSA 100 from KRÜSS
- Ellipsometer - GES5E from Sopra
- Evaporation System - Auto 306 from Boc Edwards
- Glove Box - GP(Concept)-II-P from JACOMEX
- Inert Atmosphere Chamber - from Trallero
- Inkjet Printer - ICMAB-CSIC
- Ion Milling / Sputtering / E-Beam System - TSST
- IR-Spectrometer - Vertex 70 from Bruker
- L5: Chemical Hood
- Spectrofluorometer - LS-45 from Perkin-Elmer
- Binocular Loupe
- Micro-Writer - Durham Magneto Optics LTD
- Microwave Oven - with controlled atmosphere Discover Explorer Hybrid from CEM
- Microwave Advanced Flexible Synthesis Platform (flexiWAVE) - Milestone
- Mini-Tubular Furnace
- Nano Dip Coater - ND-DC from NADETECH
- Optical Microscope - B-600 MET from OPTIKA
- Optical Microscope - Nikon Optiphot
- Photolithography Fume Hood
- Plasma Cleaner Zepto M2 - Diener Electronics
- Profilometer - P16+ from KLA Tencor
- Rapid Thermal Annealing System - from AS-micro
- Reactive Ion Etcher - RIE 2000 CE from South Bay Technology Inc.
- Rheometer - HAAKE RheoStress RS600 from Thermo Electron Corp.
- Rotary Evaporation System - R-210/215 from Büchi
- Spinner - CZ-650 from Laurell
- Spinner - SMA AC 6000
- Stove - UNB 500 from Memmert
- Tubular Furnace - ST 1002540 from HOBERSAL
- Ultrasonic Wire Bonder - 4526 from Kuliche & Soffa
- Vacuum Line
NANOQUIM @ 2017